Alexan

HTC010 Heat Transfer Compound (10ML)

HTC010 Heat Transfer Compound (10ML)

 

HTC Heat Transfer Compound is a non silicone thermal interface material recommended where the efficient and reliable thermal coupling of electrical and electronic components is required or between any surface where thermal conductivity or heat dissipation is important.  They should be applied to the base and mounting studs of diodes, transistors, thyristors, heat sinks, silicone rectifiers and semi-conductors, thermostats, power resistors and radiators.  As with all thermal interface materials, we would always encourage stringent testing before selecting a material for your application.

 

  • Properties:
  • • Excellent non-creep characteristics
  • • Very high thermal conductivity; 0.9 W/m.K
  • • Wide operating temperature -50°C to +130°C
  • • Low evaporation weight loss
  • • Easy to use and available in aerosol form, HTCA
  • • Low toxicity

HTC010 Heat Transfer Compound (10ML)

 

  • Attribute Value
  • Adhesive Type Thermal Adhesive
  • Color White
  • Package Type Syringe
  • Package Size 10 ml
  • Viscosity Measurement 127 x 141 Pa/s
  • Maximum Operating Temperature +180 °C
  • Operating Temperature Range -50°C +180 °C
  • Special Features: Based On A Non-Silicone Oil, High Performance Thermal Management Paste, Ideal For Applications Exposed To Varying Temperature And Humidity Conditions, Non-Curing Paste.
  • Minimum Operating Temperature -50 °C
  • Chemical Composition Epoxy Resin